Analytical solutions for interconnect stress in board level drop impact

10.1109/TADVP.2007.898599

Saved in:

Bibliographic Details
Main Authors:	Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.-M., Lim, T.B.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Analytical solutions Drop impact Electronic packaging Electronics packaging Integrated circuit manufacture Mechanical shocks Stress analysis
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59537
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-59537
record_format	dspace
spelling	sg-nus-scholar.10635-595372023-10-25T23:31:55Z Analytical solutions for interconnect stress in board level drop impact Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.-M. Lim, T.B. MECHANICAL ENGINEERING Analytical solutions Drop impact Electronic packaging Electronics packaging Integrated circuit manufacture Mechanical shocks Stress analysis 10.1109/TADVP.2007.898599 IEEE Transactions on Advanced Packaging 30 4 654-664 ITAPF 2014-06-17T06:12:37Z 2014-06-17T06:12:37Z 2007-11 Article Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.-M., Lim, T.B. (2007-11). Analytical solutions for interconnect stress in board level drop impact. IEEE Transactions on Advanced Packaging 30 (4) : 654-664. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2007.898599 15213323 http://scholarbank.nus.edu.sg/handle/10635/59537 000250897200008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Analytical solutions Drop impact Electronic packaging Electronics packaging Integrated circuit manufacture Mechanical shocks Stress analysis
spellingShingle	Analytical solutions Drop impact Electronic packaging Electronics packaging Integrated circuit manufacture Mechanical shocks Stress analysis Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.-M. Lim, T.B. Analytical solutions for interconnect stress in board level drop impact
description	10.1109/TADVP.2007.898599
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.-M. Lim, T.B.
format	Article
author	Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.-M. Lim, T.B.
author_sort	Wong, E.H.
title	Analytical solutions for interconnect stress in board level drop impact
title_short	Analytical solutions for interconnect stress in board level drop impact
title_full	Analytical solutions for interconnect stress in board level drop impact
title_fullStr	Analytical solutions for interconnect stress in board level drop impact
title_full_unstemmed	Analytical solutions for interconnect stress in board level drop impact
title_sort	analytical solutions for interconnect stress in board level drop impact
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/59537
_version_	1781781648958816256

Analytical solutions for interconnect stress in board level drop impact

Similar Items