Integrated liquid cooling systems for 3-D stacked TSV modules

10.1109/TCAPT.2009.2033039

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Bibliographic Details
Main Authors:	Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	3-D TSV module Integrated cooling solution Pressure drop Thermal management
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60565
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60565
record_format	dspace
spelling	sg-nus-scholar.10635-605652023-10-31T07:20:22Z Integrated liquid cooling systems for 3-D stacked TSV modules Tang, G.Y. Tan, S.P. Khan, N. Pinjala, D. Lau, J.H. Yu, A.B. Vaidyanathan, K. Toh, K.C. MECHANICAL ENGINEERING 3-D TSV module Integrated cooling solution Pressure drop Thermal management 10.1109/TCAPT.2009.2033039 IEEE Transactions on Components and Packaging Technologies 33 1 184-195 ITCPF 2014-06-17T06:24:45Z 2014-06-17T06:24:45Z 2010-03 Article Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C. (2010-03). Integrated liquid cooling systems for 3-D stacked TSV modules. IEEE Transactions on Components and Packaging Technologies 33 (1) : 184-195. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2009.2033039 15213331 http://scholarbank.nus.edu.sg/handle/10635/60565 000275560000021 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	3-D TSV module Integrated cooling solution Pressure drop Thermal management
spellingShingle	3-D TSV module Integrated cooling solution Pressure drop Thermal management Tang, G.Y. Tan, S.P. Khan, N. Pinjala, D. Lau, J.H. Yu, A.B. Vaidyanathan, K. Toh, K.C. Integrated liquid cooling systems for 3-D stacked TSV modules
description	10.1109/TCAPT.2009.2033039
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tang, G.Y. Tan, S.P. Khan, N. Pinjala, D. Lau, J.H. Yu, A.B. Vaidyanathan, K. Toh, K.C.
format	Article
author	Tang, G.Y. Tan, S.P. Khan, N. Pinjala, D. Lau, J.H. Yu, A.B. Vaidyanathan, K. Toh, K.C.
author_sort	Tang, G.Y.
title	Integrated liquid cooling systems for 3-D stacked TSV modules
title_short	Integrated liquid cooling systems for 3-D stacked TSV modules
title_full	Integrated liquid cooling systems for 3-D stacked TSV modules
title_fullStr	Integrated liquid cooling systems for 3-D stacked TSV modules
title_full_unstemmed	Integrated liquid cooling systems for 3-D stacked TSV modules
title_sort	integrated liquid cooling systems for 3-d stacked tsv modules
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60565
_version_	1781781870052114432

Integrated liquid cooling systems for 3-D stacked TSV modules

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