The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding

by Yu, D., Lee, C., Lau, J.H.
Published 2014

Prevalence and factors associated with smoking among medical students in a local university

by Gyanchand Rampal, Lekhraj Rampal, David, N. C. E., Lau, J. H.
Published 2006

A rare complication of middle ear cholesteatoma - Pseudoaneurysm of petrous internal carotid artery

by Lim, L. Y., Mohamad, Irfan, Lau, J. H, Tang, I. P.
Published 2017

Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

by Lee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H.
Published 2014

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

by Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.
Published 2014

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

by Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H.
Published 2014

Development of wafer level packaged scanning micromirrors

by Yu, A., Lee, C., Yan, L.L., Zhang, Q.X., Yoon, S.U., Lau, J.H.
Published 2014

Design and modeling of nanophotonic beam structures as optical NEMS sensors

by Lee, C., Thillaigovindan, J., Yu, A., Radhakrishnan, R., Chen, C.-C., Chao, Y.-T., Lau, J.H.
Published 2014

A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

by Yan, L., Lee, C., Yu, D., Choi, W.K., Yu, A., Yoon, S.U., Lau, J.H.
Published 2014

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

by Lee, C., Yu, A., Yan, L., Wang, H., He, J.H., Zhang, Q.X., Lau, J.H.
Published 2014

Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization

by Yu, D., Yan, L., Lee, C., Choi, W.K., Thew, M.L., Foo, C.K., Lau, J.H.
Published 2014

Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

by Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
Published 2014

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

by Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C.
Published 2014

Study of Ag-In solder as low temperature wafer bonding intermediate layer

by Made, R.I., Gan, C.L., Lee, C., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H.
Published 2014

A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

by Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.
Published 2014

Integrated liquid cooling systems for 3-D stacked TSV modules

by Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C.
Published 2014

Development of low temperature bonding using in-based solders

by Choi, W.K., Yu, D., Lee, C., Yan, L., Yu, A., Yoon, S.W., Lau, J.H., Cho, M.G., Jo, Y.H., Lee, H.M.
Published 2014