Development of low temperature bonding using in-based solders

Development of low temperature bonding using in-based solders

10.1109/ECTC.2008.4550142

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Bibliographic Details
Main Authors: Choi, W.K., Yu, D., Lee, C., Yan, L., Yu, A., Yoon, S.W., Lau, J.H., Cho, M.G., Jo, Y.H., Lee, H.M.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83626
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/83626

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