Development of low temperature bonding using in-based solders

10.1109/ECTC.2008.4550142

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Bibliographic Details
Main Authors:	Choi, W.K., Yu, D., Lee, C., Yan, L., Yu, A., Yoon, S.W., Lau, J.H., Cho, M.G., Jo, Y.H., Lee, H.M.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/83626
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-83626
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spelling	sg-nus-scholar.10635-836262015-01-08T04:46:57Z Development of low temperature bonding using in-based solders Choi, W.K. Yu, D. Lee, C. Yan, L. Yu, A. Yoon, S.W. Lau, J.H. Cho, M.G. Jo, Y.H. Lee, H.M. ELECTRICAL & COMPUTER ENGINEERING 10.1109/ECTC.2008.4550142 Proceedings - Electronic Components and Technology Conference 1294-1299 PECCA 2014-10-07T04:43:21Z 2014-10-07T04:43:21Z 2008 Conference Paper Choi, W.K.,Yu, D.,Lee, C.,Yan, L.,Yu, A.,Yoon, S.W.,Lau, J.H.,Cho, M.G.,Jo, Y.H.,Lee, H.M. (2008). Development of low temperature bonding using in-based solders. Proceedings - Electronic Components and Technology Conference : 1294-1299. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2008.4550142" target="_blank">https://doi.org/10.1109/ECTC.2008.4550142</a> 9781424422302 05695503 http://scholarbank.nus.edu.sg/handle/10635/83626 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/ECTC.2008.4550142
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Choi, W.K. Yu, D. Lee, C. Yan, L. Yu, A. Yoon, S.W. Lau, J.H. Cho, M.G. Jo, Y.H. Lee, H.M.
format	Conference or Workshop Item
author	Choi, W.K. Yu, D. Lee, C. Yan, L. Yu, A. Yoon, S.W. Lau, J.H. Cho, M.G. Jo, Y.H. Lee, H.M.
spellingShingle	Choi, W.K. Yu, D. Lee, C. Yan, L. Yu, A. Yoon, S.W. Lau, J.H. Cho, M.G. Jo, Y.H. Lee, H.M. Development of low temperature bonding using in-based solders
author_sort	Choi, W.K.
title	Development of low temperature bonding using in-based solders
title_short	Development of low temperature bonding using in-based solders
title_full	Development of low temperature bonding using in-based solders
title_fullStr	Development of low temperature bonding using in-based solders
title_full_unstemmed	Development of low temperature bonding using in-based solders
title_sort	development of low temperature bonding using in-based solders
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/83626
_version_	1681089470560993280

Development of low temperature bonding using in-based solders

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