Development of low temperature bonding using in-based solders

• Main Authors: Choi, W.K., Yu, D., Lee, C., Yan, L., Yu, A., Yoon, S.W., Lau, J.H., Cho, M.G., Jo, Y.H., Lee, H.M.
• 其他作者: ELECTRICAL & COMPUTER ENGINEERING
• 格式: Conference or Workshop Item
• 出版: 2014
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/83626

10.1109/ECTC.2008.4550142