Development of low temperature bonding using in-based solders

• Main Authors: Choi, W.K., Yu, D., Lee, C., Yan, L., Yu, A., Yoon, S.W., Lau, J.H., Cho, M.G., Jo, Y.H., Lee, H.M.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/83626
• Institution: National University of Singapore

10.1109/ECTC.2008.4550142