Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
10.1007/s11664-008-0555-8
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Main Authors: | Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83103 |
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Institution: | National University of Singapore |
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