Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

10.1007/s11664-008-0555-8

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Bibliographic Details
Main Authors:	Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	IC Indium Low-temperature solder MEMS Packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/83103
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-83103
record_format	dspace
spelling	sg-nus-scholar.10635-831032023-10-25T22:15:33Z Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications Made, R.I. Gan, C.L. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. Lee, C. ELECTRICAL & COMPUTER ENGINEERING IC Indium Low-temperature solder MEMS Packaging 10.1007/s11664-008-0555-8 Journal of Electronic Materials 38 2 365-371 JECMA 2014-10-07T04:37:18Z 2014-10-07T04:37:18Z 2009-02 Article Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C. (2009-02). Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications. Journal of Electronic Materials 38 (2) : 365-371. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0555-8 03615235 http://scholarbank.nus.edu.sg/handle/10635/83103 000262482200020 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	IC Indium Low-temperature solder MEMS Packaging
spellingShingle	IC Indium Low-temperature solder MEMS Packaging Made, R.I. Gan, C.L. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. Lee, C. Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
description	10.1007/s11664-008-0555-8
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Made, R.I. Gan, C.L. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. Lee, C.
format	Article
author	Made, R.I. Gan, C.L. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. Lee, C.
author_sort	Made, R.I.
title	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
title_short	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
title_full	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
title_fullStr	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
title_full_unstemmed	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
title_sort	study of low-temperature thermocompression bonding in ag-in solder for packaging applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/83103
_version_	1781784302144454656

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

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