Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

• Main Authors: Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Article
• Published: 2014
• Subjects: IC; Indium; Low-temperature solder; MEMS; Packaging
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/83103
• Institution: National University of Singapore

10.1007/s11664-008-0555-8