Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

• Main Authors: Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C.
• 其他作者: ELECTRICAL & COMPUTER ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: IC; Indium; Low-temperature solder; MEMS; Packaging
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/83103

10.1007/s11664-008-0555-8