Study of Ag-In solder as low temperature wafer bonding intermediate layer
10.1117/12.762046
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2014
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sg-nus-scholar.10635-842452024-11-09T08:00:15Z Study of Ag-In solder as low temperature wafer bonding intermediate layer Made, R.I. Gan, C.L. Lee, C. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING Ag In Low temperature bonding Packaging Solder 10.1117/12.762046 Proceedings of SPIE - The International Society for Optical Engineering 6884 - PSISD 2014-10-07T04:50:27Z 2014-10-07T04:50:27Z 2008 Conference Paper Made, R.I., Gan, C.L., Lee, C., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H. (2008). Study of Ag-In solder as low temperature wafer bonding intermediate layer. Proceedings of SPIE - The International Society for Optical Engineering 6884 : -. ScholarBank@NUS Repository. https://doi.org/10.1117/12.762046 9780819470591 0277786X http://scholarbank.nus.edu.sg/handle/10635/84245 000255942000015 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
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Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
Ag In Low temperature bonding Packaging Solder |
| spellingShingle |
Ag In Low temperature bonding Packaging Solder Made, R.I. Gan, C.L. Lee, C. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. Study of Ag-In solder as low temperature wafer bonding intermediate layer |
| description |
10.1117/12.762046 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Made, R.I. Gan, C.L. Lee, C. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. |
| format |
Conference or Workshop Item |
| author |
Made, R.I. Gan, C.L. Lee, C. Yan, L.L. Yu, A. Yoon, S.W. Lau, J.H. |
| author_sort |
Made, R.I. |
| title |
Study of Ag-In solder as low temperature wafer bonding intermediate layer |
| title_short |
Study of Ag-In solder as low temperature wafer bonding intermediate layer |
| title_full |
Study of Ag-In solder as low temperature wafer bonding intermediate layer |
| title_fullStr |
Study of Ag-In solder as low temperature wafer bonding intermediate layer |
| title_full_unstemmed |
Study of Ag-In solder as low temperature wafer bonding intermediate layer |
| title_sort |
study of ag-in solder as low temperature wafer bonding intermediate layer |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/84245 |
| _version_ |
1821207051849695232 |