Development of stretch solder interconnections for wafer level packaging

10.1109/TADVP.2008.923390

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Bibliographic Details
Main Authors:	Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Hourglass interconnect Solder joint reliability Stretch solder interconnect Temperature cycling Wafer level packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59946
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-59946
record_format	dspace
spelling	sg-nus-scholar.10635-599462024-11-13T13:22:38Z Development of stretch solder interconnections for wafer level packaging Rajoo, R. Lim, S.S. Wong, E.H. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R. MECHANICAL ENGINEERING Hourglass interconnect Solder joint reliability Stretch solder interconnect Temperature cycling Wafer level packaging 10.1109/TADVP.2008.923390 IEEE Transactions on Advanced Packaging 31 2 377-385 ITAPF 2014-06-17T06:17:24Z 2014-06-17T06:17:24Z 2008-05 Article Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2008-05). Development of stretch solder interconnections for wafer level packaging. IEEE Transactions on Advanced Packaging 31 (2) : 377-385. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.923390 15213323 http://scholarbank.nus.edu.sg/handle/10635/59946 000258768300016 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Hourglass interconnect Solder joint reliability Stretch solder interconnect Temperature cycling Wafer level packaging
spellingShingle	Hourglass interconnect Solder joint reliability Stretch solder interconnect Temperature cycling Wafer level packaging Rajoo, R. Lim, S.S. Wong, E.H. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R. Development of stretch solder interconnections for wafer level packaging
description	10.1109/TADVP.2008.923390
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Rajoo, R. Lim, S.S. Wong, E.H. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R.
format	Article
author	Rajoo, R. Lim, S.S. Wong, E.H. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R.
author_sort	Rajoo, R.
title	Development of stretch solder interconnections for wafer level packaging
title_short	Development of stretch solder interconnections for wafer level packaging
title_full	Development of stretch solder interconnections for wafer level packaging
title_fullStr	Development of stretch solder interconnections for wafer level packaging
title_full_unstemmed	Development of stretch solder interconnections for wafer level packaging
title_sort	development of stretch solder interconnections for wafer level packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/59946
_version_	1821182283921489920

Development of stretch solder interconnections for wafer level packaging

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