Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
10.1016/j.sna.2008.10.011
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Main Authors: | , , , , , , |
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Other Authors: | |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/82043 |
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Institution: | National University of Singapore |
Summary: | 10.1016/j.sna.2008.10.011 |
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