Wafer level packaging of pressure sensor using SU8 photoresist

• Main Authors: Iliescu, C., Tay, F.E.H., Miao, J., Avram, M.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Pressure sensor; SU8; Wafer level packaging; Wafer-to-wafer bonding
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/74011
• Institution: National University of Singapore

10.1117/12.582235