Wafer level packaging of pressure sensor using SU8 photoresist

Wafer level packaging of pressure sensor using SU8 photoresist

10.1117/12.582235

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Bibliographic Details
Main Authors: Iliescu, C., Tay, F.E.H., Miao, J., Avram, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Pressure sensor
SU8
Wafer level packaging
Wafer-to-wafer bonding
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74011
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Institution: National University of Singapore
id sg-nus-scholar.10635-74011
record_format dspace
spelling sg-nus-scholar.10635-740112024-11-12T19:00:13Z Wafer level packaging of pressure sensor using SU8 photoresist Iliescu, C. Tay, F.E.H. Miao, J. Avram, M. MECHANICAL ENGINEERING Pressure sensor SU8 Wafer level packaging Wafer-to-wafer bonding 10.1117/12.582235 Proceedings of SPIE - The International Society for Optical Engineering 5649 PART 1 297-305 PSISD 2014-06-19T05:42:03Z 2014-06-19T05:42:03Z 2005 Conference Paper Iliescu, C., Tay, F.E.H., Miao, J., Avram, M. (2005). Wafer level packaging of pressure sensor using SU8 photoresist. Proceedings of SPIE - The International Society for Optical Engineering 5649 (PART 1) : 297-305. ScholarBank@NUS Repository. https://doi.org/10.1117/12.582235 0277786X http://scholarbank.nus.edu.sg/handle/10635/74011 000228610400034 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Pressure sensor
SU8
Wafer level packaging
Wafer-to-wafer bonding
spellingShingle Pressure sensor
SU8
Wafer level packaging
Wafer-to-wafer bonding
Iliescu, C.
Tay, F.E.H.
Miao, J.
Avram, M.
Wafer level packaging of pressure sensor using SU8 photoresist
description 10.1117/12.582235
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Iliescu, C.
Tay, F.E.H.
Miao, J.
Avram, M.
format Conference or Workshop Item
author Iliescu, C.
Tay, F.E.H.
Miao, J.
Avram, M.
author_sort Iliescu, C.
title Wafer level packaging of pressure sensor using SU8 photoresist
title_short Wafer level packaging of pressure sensor using SU8 photoresist
title_full Wafer level packaging of pressure sensor using SU8 photoresist
title_fullStr Wafer level packaging of pressure sensor using SU8 photoresist
title_full_unstemmed Wafer level packaging of pressure sensor using SU8 photoresist
title_sort wafer level packaging of pressure sensor using su8 photoresist
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/74011
_version_ 1821202053877202944

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