SU8 adhesive bonding using contact imprinting

SU8 adhesive bonding using contact imprinting

10.1109/SMICND.2006.283965

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Bibliographic Details
Main Authors: Yu, L., Iliescu, C., Tay, F.E.H., Chen, B.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Adhesive bonding
Contact imprinting
SU-8 photoresist
Wafer-to-wafer bonding
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73891
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73891

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