SU8 adhesive bonding using contact imprinting
10.1109/SMICND.2006.283965
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sg-nus-scholar.10635-738912015-04-18T16:41:39Z SU8 adhesive bonding using contact imprinting Yu, L. Iliescu, C. Tay, F.E.H. Chen, B. MECHANICAL ENGINEERING Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding 10.1109/SMICND.2006.283965 Proceedings of the International Semiconductor Conference, CAS 1 189-192 2014-06-19T05:40:35Z 2014-06-19T05:40:35Z 2007 Conference Paper Yu, L.,Iliescu, C.,Tay, F.E.H.,Chen, B. (2007). SU8 adhesive bonding using contact imprinting. Proceedings of the International Semiconductor Conference, CAS 1 : 189-192. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/SMICND.2006.283965" target="_blank">https://doi.org/10.1109/SMICND.2006.283965</a> 1424401097 http://scholarbank.nus.edu.sg/handle/10635/73891 NOT_IN_WOS Scopus |
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Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding |
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Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding Yu, L. Iliescu, C. Tay, F.E.H. Chen, B. SU8 adhesive bonding using contact imprinting |
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10.1109/SMICND.2006.283965 |
author2 |
MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Yu, L. Iliescu, C. Tay, F.E.H. Chen, B. |
format |
Conference or Workshop Item |
author |
Yu, L. Iliescu, C. Tay, F.E.H. Chen, B. |
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Yu, L. |
title |
SU8 adhesive bonding using contact imprinting |
title_short |
SU8 adhesive bonding using contact imprinting |
title_full |
SU8 adhesive bonding using contact imprinting |
title_fullStr |
SU8 adhesive bonding using contact imprinting |
title_full_unstemmed |
SU8 adhesive bonding using contact imprinting |
title_sort |
su8 adhesive bonding using contact imprinting |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/73891 |
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1681087830267265024 |