Wafer level packaging of pressure sensor using SU8 photoresist

由 Iliescu, C., Tay, F.E.H., Miao, J., Avram, M.
出版 2014

Theoretical analysis and experiment of a novel dep chip with 3-D silicon electrodes

由 Yu, L., Tay, F.E.H., Xu, G., Ilscu, C., Avram, M.
出版 2014

Two masks process for high aspect ratio inertial sensors with ajustable range

由 Iliescu, C., Avram, M., Miao, J., Tay, F.E.H., Xu, G.
出版 2014

A new fabrication process of silicon nanotips - NERCOM

由 Tay, F.E.H., Iliescu, C., Xu, G., Chen, B., Avram, M.
出版 2014

Adhesive bonding with SU-8 at wafer level for microfluidic devices

由 Yu, L., Tay, F.E.H., Xu, G., Chen, B., Avram, M., Iliescu, C.
出版 2014