The evolutions of microstructure in pressureless Sintered Silver die attach material

by S.R., Esa, G., Omar, S.H. Sheikh, Md Fadzullah, K.S Siow, B., Abdul Rahim
Published 2021

Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

by Siti Rahmah, Esa, Genesia, Omar, Siti Hajar, Sheikh Md Fadzullah, Kim, S. Siow, B. Abdul Rahim, B. Çoşut
Published 2020