Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering

by Ali Mokhtar, Mohd Najib, Mohammed Zulkifly, Abdullah, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri
Published 2019

Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process

by Ali Mokhtar, Mohd Najib, Abdullah, Mohd Zulkifly, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri
Published 2018

Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering

by Abdullah, Mohd Zulkifly, Ali Mokhtar, Mohd Najib, Saad, Abdullah Aziz, Samsudin, Zambri, Che Ani, Fakhrozi
Published 2017

Hydrophobicity Performance Of Polyethylene Terephthalate (PET) And Thermoplastic Polyurethane (TPU) With Thermal Effect

by Jasmee, Solehah, Omar, Ghazali, Masripan, Nor Azmmi, Kamarolzaman, Anita Akmar, A S Ashikin, Che Ani, Fakhrozi
Published 2018

Thermo-Mechanical And Adhesion Performance Of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate

by Omar, Ghazali, A Hamid, Husna, Azli, Siti Ashikin, Jasmee, Solehah, Jalar, Azman, Tamaldin, Noreffendy, Che Ani, Fakhrozi
Published 2020