Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers

by Goh, Yi Sing, Goh, Yingxin, Chia, Pay Ying, Haseeb, A. S. M. A.
Published 2021

Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

by Goh, Yingxin, Goh, Yi Sing, Lee, Ee Lynn, Ong, Meng Teck, Haseeb, A.S. Md. Abdul
Published 2018

Review-electrochemical migration in electronic materials: Factors affecting the mechanism and recent strategies for inhibition

by Lee, Ee Lynn, Goh, Yi Sing, Haseeb, A. S. M. A., Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, Boon Yew
Published 2023

Effects of concentration of adipic acid on the electrochemical migration of tin for printed circuit board assembly

by Goh, Yi Sing, Haseeb, A. S. M. A., Basirun, Wan Jeffrey, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, Boon Yew
Published 2023