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He, Feifei
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He, Feifei
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He, Feifei
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1
3D electromigration modeling at the circuit layout level
by
He
,
Feifei
Published 2012
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Theses and Dissertations
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2
Comparison of electromigration simulation in test structure and actual circuit
by
He
,
Feifei
,
Tan, Cher Ming
Published 2013
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3
Effect of IC layout on the reliability of CMOS amplifiers
by
He
,
Feifei
,
Tan, Cher Ming
Published 2013
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4
Electromigration reliability of interconnections in RF low noise amplifier circuit
by
He
,
Feifei
,
Tan, Cher Ming
Published 2013
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5
3D circuit model for 3D IC reliability study
by
Tan, Cher Ming
,
He
,
Feifei
Published 2010
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Conference or Workshop Item
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6
3D simulation-based research on the effect of interconnect structures on circuit reliability
by
He
,
Feifei
,
Tan, Cher Ming
Published 2015
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7
Degradation behavior of high power light emitting diode under high frequency switching
by
Chen, S. H.
,
Tan, G. H.
,
Tan, Cher Ming
,
He
,
Feifei
Published 2013
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8
Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation
by
Zhang, Shuai
,
Tan, Cher Ming
,
Cheng, Shuguang
,
Deng, Tianqi
,
He
,
Feifei
,
Su, Haibin
Published 2016
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