3D electromigration modeling at the circuit layout level

由 He, Feifei
出版 2012

Comparison of electromigration simulation in test structure and actual circuit

由 He, Feifei, Tan, Cher Ming
出版 2013

Effect of IC layout on the reliability of CMOS amplifiers

由 He, Feifei, Tan, Cher Ming
出版 2013

Electromigration reliability of interconnections in RF low noise amplifier circuit

由 He, Feifei, Tan, Cher Ming
出版 2013

3D circuit model for 3D IC reliability study

由 Tan, Cher Ming, He, Feifei
出版 2010

3D simulation-based research on the effect of interconnect structures on circuit reliability

由 He, Feifei, Tan, Cher Ming
出版 2015

Degradation behavior of high power light emitting diode under high frequency switching

由 Chen, S. H., Tan, G. H., Tan, Cher Ming, He, Feifei
出版 2013

Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation

由 Zhang, Shuai, Tan, Cher Ming, Cheng, Shuguang, Deng, Tianqi, He, Feifei, Su, Haibin
出版 2016