DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels

by Kok, Hoi Ern, Lau, Kok Tee
Published 2021

Effect Of Laminating Press’s Opening-Stacking Position On Adhesive Thickness In Coverlay/Adhesive/Flexible-Printed-Circuit Sheet

by Lau, Kok Tee, Kok, Hoi Ern, Ab Maulod, Hairul Effendy, Abdul Latiff, Nurizzatul Zahirah, Abdul Aziz, Aida Nazifa, Rosli, Nur Hazirah
Published 2019