Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations

by Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong
Published 2013

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

by Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan
Published 2013