Numerical simulation of underfill encapsulation process based on characteritsic split method

by Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Aswatha Narayana, P. A., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Flow analysis for flip chip underfilling process using characteristic based split method

by Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Aswatha Narayana, P. A., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014