WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

by LU, HAIJING, GONG, HAO, WONG, CHEE KHUEN STEPHEN
Published 2012

WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

by LU, HAIJING, GONG, HAO, WONG, CHEE KHUEN STEPHEN
Published 2012

Electrical and optical properties of hybrid transparent electrodes that use metal grids and graphene films

by Ho, Xinning, Lu, Haijing, Liu, Wenjun, Tey, Ju Nie, Cheng, Chek Kweng, Kok, Eugene, Wei, Jun
Published 2014