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Manoj P. D, Sai
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Manoj P. D, Sai
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Manoj P. D, Sai
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A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os
by
Wu, Sih-Sian
,
Wang, Kanwen
,
Manoj
P
.
D
,
Sai
,
Ho, Tsung-Yi
,
Yu, Mingbin
,
Yu, Hao
Published 2015
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