Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

by Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, M.R., Munroe, P.R., Quadir, M.Z.
Published 2013

The benefit and impact of on-line tools for microscopy and microanalysis training and education in core facilities

by Shapter, J., Muhling, J., Soon, L., Ringer, S.P., Grinan, E., Frost, C., Cribb, B., Apperley, M., Munroe, P.R., White, Timothy John
Published 2015