Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review

by Mohd Arif Anuar, Mohd Salleh, McDonald, Stuart D., Nogita, Kazuhiro
Published 2014

Effect of phonon-boundary scattering on phonon-drag factor in Seebeck coefficient of Si wire

by Fauziah, K., Suzuki, Y., Nogita, T., Kamakura, Y., Watanabe, T., Salleh, F., Ikeda, H.
Published 2020

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

by ‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
Published 2020

A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

by Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al Bakri, Abdullah, Sandu, Andrei Victor, Norainiza, Saud, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., McDonald, Stuart D., Nogita, Kazuhiro
Published 2014

Microstructure evolution of Ag/TiO₂ thin film

by Dewi Suriyani, Che Halin, Dewi Suriyani, Che Halin, Kamrosni, Abdul Razak, Mohd Arif Anuar, Mohd Salleh, Mohd Izrul Izwan, Ramli, Mohd Mustafa Al Bakri, Abdullah, Ayu Wazira, Azhari, Kazuhiro, Nogita, Hideyuki, Yasuda, Nabiałek, Marcin, Wysłocki, Jerzy J.
Published 2022