Wafer level super stretch solder

by WONG, EE HUA, RAJOO, RANJAN, TEO, POI SIONG
Published 2012

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

by Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan
Published 2013