نتائج بحث المؤلف

1

Characterization, interaction and failure analysis of lead-free solder bump interconnects

Characterization, interaction and failure analysis of lead-free solder bump interconnects

بواسطة Thong, Chee Meng.
منشور في 2008

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Theses and Dissertations

2

Mechanism-based modeling of ductile void growth failure in multilayer structures

Mechanism-based modeling of ductile void growth failure in multilayer structures

بواسطة THONG CHEE MENG
منشور في 2011

احصل على النص الكامل

Theses and Dissertations