Exergy analysis of the cross vane expander-compressor unit

由 Tan, Hong Wei
出版 2015

Development of sintering processes and applications for 3D printing of electronics

由 Tan, Hong Wei
出版 2020

Study and analysis of soft grippers for assembly tasks

由 Tan, Hong Wei
出版 2024

Reinforced soil (RS) walls for Mitigation of close range blast loading

由 TAN HONG WEI, ANDY
出版 2010

中国钻石零售市场分析及营销对策初探 = The market of retail diamonds and sales strategy in China

由 谈宏伟 Tan, Hong Wei
出版 2011

Droplet impact on heated powder bed

由 Liu, Dongdong, Tan, Hong-Wei, Tran, Tuan
出版 2020

A Study of the State-of-the-Art Printed Passive Electronic Components through Fully Additive Manufacturing Methods

由 Tan, Hong Wei, Chua, Chee Kai, Tran, Tuan
出版 2016

Review of 3D printed electronics : metallic nanoparticles inks

由 Tan, Hong Wei, Chua, Chee Kai, Tran, Tuan
出版 2018

Metallic nanoparticle inks for 3D printing of electronics

由 Tan, Hong Wei, An, Jia, Chua, Chee Kai, Tran, Tuan
出版 2020

Induction sintering of silver nanoparticle inks on polyimide substrates

由 Tan, Hong Wei, Saengchairat, Nitipon, Goh, Guo Liang, An, Jia, Chua, Chee Kai, Tran, Tuan
出版 2020

Lybatides from Lycium barbarum contain an unusual cystine-stapled helical peptide scaffold

由 Tan, Wei Liang, Wong, Ka Ho, Lei, Jian, Sakai, Naoki, Tan, Hong Wei, Hilgenfeld, Rolf, Tam, James P.
出版 2018

The global rise of 3D printing during the COVID-19 pandemic

由 Choong, Yu Ying Clarrisa, Tan, Hong Wei, Patel, Deven C., Choong, Natalie Wan Ting, Chen, Chun-Hsien, Low, Hong Yee, Tan, Ming Jen, Patel, Chandrakant D., Chua, Chee Kai
出版 2023