Effects of ball pad configuration on joint reliability in BGA chip-scale packages

by Chong, V., Kheng, L.T., Teck, L.C., Gunawan, D.K.
Published 2014

Patterning of graphene with tunable size and shape for microelectrode array devices

by Ng, A.M.H., Wang, Y., Lee, W.C., Teck, L.C., Loh, K.P., Low, H.Y.
Published 2014