A nonstandard finite difference scheme for a strain-gradient theory

由 Vedantam, S.
出版 2014

Constitutive equations for rate-dependent pseudoelastic behaviour of shape memory alloys

由 Vedantam, S.
出版 2014

Structural phase transitions in a discrete one-dimensional chain

由 Vedantam, S., Mohanraj, S.
出版 2014

Phase-field theory of grain growth in the presence of mobile second-phase particles

由 Vedantam, S., Mallick, A.
出版 2014

Phase field simulation of polycrystalline grain growth in presence of mobile second phase particles

由 Mallick, A., Vedantam, S.
出版 2014

Hydromechanics in dentine: Role of dentinal tubules and hydrostatic pressure on mechanical stress-strain distribution

由 Kishen, A., Vedantam, S.
出版 2014

A Helmholtz free-energy function for a Cu-Al-Ni shape memory alloy

由 Vedantam, S., Abeyaratne, R.
出版 2014

Corrigendum to "Phase-field theory of grain growth in the presence of mobile second-phase particles" [Acta Mater. 58 (2010) 272-281] (DOI:10.1016/j.actamat.2009.09.001)

由 Vedantam, S., Mallick, A.
出版 2014

Phase field study of the effect of grain boundary energy anisotropy on grain growth

由 Mallick, A., Vedantam, S.
出版 2014

Constitutive modeling of contact angle hysteresis

由 Vedantam, S., Panchagnula, M.V.
出版 2014

Comment on how Wenzel and Cassie were wrong by Gao and McCarthy

由 Panchagnula, M.V., Vedantam, S.
出版 2014

Phase field modeling of hysteresis in sessile drops

由 Vedantam, S., Panchagnula, M.V.
出版 2014

Efficient numerical algorithm for multiphase field simulations

由 Vedantam, S., Patnaik, B.S.V.
出版 2014

Grain size dependent tensile behavior of Mg-3%Al alloy at elevated temperatures

由 Mallick, A., Vedantam, S., Lu, L.
出版 2014

Ultrafine Mg-3%Al alloy: Its synthesis and investigation of its tensile properties at elevated temperature

由 Mallick, A., Vedantam, S., Li, L.
出版 2014

Asymmetric wetting of patterned surfaces composed of intrinsically hysteretic materials

由 Anantharaju, N., Panchagnula, M.V., Vedantam, S.
出版 2014

Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects

由 Wei, S., Tay, A.A.O., Vedantam, S.
出版 2014

A numerical study of fatigue life of copper column interconnections in wafer level packages

由 Sun, W., Tay, A.A.O., Vedantam, S.
出版 2014

Mechanical characteristics of pure Mg and a Mg/Y2O3 nanocomposite in the 25-250 °c temperature range

由 Mallick, A., Tun, K.S., Vedantam, S., Gupta, M.
出版 2014

Perturbation solution of the shape of a nonaxisymmetric sessile drop

由 Prabhala, B., Panchagnula, M., Subramanian, V.R., Vedantam, S.
出版 2014