Scalable Sub-micron Patterning of Organic Materials Toward High Density Soft Electronics

by Kim, J, Kim, M.-G, Kim, J, Jo, S, Kang, J, Jo, J.-W, Lee, W, Hwang, C, Moon, J, Yang, L, Kim, Y.-H, Noh, Y.-Y, Yun Jaung, J, Kim, Y.-H, Kyu Park, S
Published 2020