High temperature creep and hydrogen embrittlement failure of a steam trap bypass tube

by Mohd Arif Anuar, Mohd Salleh, Shaiful Rizam, Shamsudin, Darwin, Sebayang, Ir. Ing. Prof. Dr, Nik Noriman, Zulkepli, Sitompul, Anton, DIC, Syahril
Published 2014

Metallurgical failure analysis of a closed recirculation system water cooling pipe

by Mohd Arif Anuar, Mohd Salleh, Shaiful Rizam, Shamsudin, Azmi, Kamardin, Noor Hamidi, Mohd Noor, Hafizan, Hassan
Published 2014

Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application

by Aida Fakhrul, Lamakasauk, Nurul Shakina, Surani, Mohd Arif Anuar, Mohd Salleh, Nik Noriman, Zulkepli, Dr., Mohd Mustafa Al-Bakri, Abdullah, Rosniza, Hamzah, Mohamad, Abu Bakar
Published 2013

Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application

by Aida Fakhrul, Lamakasauk, Nurul Shakina, Surani, Mohd Arif Anuar, Mohd Salleh, Nik Noriman, Zulkepli, Dr., Mohd Mustafa Al-Bakri, Abdullah, Rosniza, Hamzah, Mohamad, Abu Bakar
Published 2013

Metallurgical failure analysis of a steam trap bypass tube

by Mohd Arif Anuar, Mohd Salleh, Darwin, Sebayang, Syahril, D. I. C, Anton, Sitompul
Published 2011

Long term overheating failure of a closed recirculation system water cooling pipe

by Mohd Arif Anuar, Mohd Salleh, Shaiful Rizam, Shamsudin, Azmi, Kamardin, Hafizan, Hassan
Published 2011

Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder

by Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., Khairel Rafezi, Ahmad, Dr., Mohd Arif Anuar, Mohd Salleh, Muhammad Hafiz, Hazizi, Zainal Arifin, Ahmad, Prof. Dr.
Published 2011

Research advances of composite solder material fabricated via powder metallurgy route

by Mohd Arif Anuar, Mohd Salleh, Muhammad Hafiz, Hazizi, Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
Published 2014

Research development of solder materials and its intermetallic compound (IMC) study

by Mohd Arif Anuar, Mohd Salleh, Najib S., Ibrahim, Saud, N., Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
Published 2014

Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints

by Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Mayappan, Ramani, Noor Farhani, Mohd Alui
Published 2014

Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder

by Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Nik Noriman, Zulkepli, Dr., Khairel Rafezi, Ahmad, Dr., Mayappan, Ramani, Noor Farhani, Mohd Alui
Published 2014

Zn-Sn based high temperature solder - A short review

by Sayyidah Amnah, Musa, Mohd Arif Anuar, Mohd Salleh, Norainiza, Saud
Published 2014

Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder

by Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I. Najib
Published 2014

Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

by Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I, Najib
Published 2014

A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

by Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al Bakri, Abdullah, Sandu, Andrei Victor, Norainiza, Saud, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., McDonald, Stuart D., Nogita, Kazuhiro
Published 2014

Research development of solder materials and its intermetallic compound (IMC) study

by Mohd Arif Anuar, Mohd Salleh, Najib Saedi, Ibrahim, Saud, N., Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
Published 2014

Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder

by Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, Najib Saedi, Ibrahim
Published 2014

Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

by Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, Najib Saedi, Ibrahim
Published 2014

Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder

by Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al-Bakri, Abdullah, Muhammad Hafiz, Zan Hazizi, Flora, Somidin, Noor Farhani, Mohd Alui, Zainal Arifin, Ahmad, Prof.
Published 2013

Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder

by Mohd Arif Anuar, Mohd Salleh, Nur Syahirah, Mohamad Zaim, Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al Bakri, Abdullah, Marliza, Mostapha, Romisuhani, Ahmad
Published 2022