Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

by Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Foong, Chee Seng, Tan, Chou Yong, Dr., Retnasamy, Vithyacharan
Published 2014

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

by Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
Published 2014