Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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Bibliographic Details
Main Authors: Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
Other Authors: kbyap@uniten.edu.my
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
ABAQUS
Finite element analysis
Flip chip
Solder ball
Stress (materials)
Thermal analysis
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891

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