Fast transient solutions for heat transfer [FEM]

by Ooi, Chen Hee, Seetharamu, Kankanhally N., Zainal Alimuddin, Zainal Alauddin, Dr., Ghulam, Abdul Quadir, Prof. Dr., Sim, K. S., Goh, Teck Joo
Published 2014

FEM analysis of multifluid heat exchangers

by Seetharamu, Kankanhally N., Quadir, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Krishnan, Ganapathi M.
Published 2014

Finite element modelling of solidification phenomena

by Seetharamu, Kankanhally N., Paragasam, R., Quadir, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Prasad, B. S., Sundararajan, Thirumalachari
Published 2014

Flip chip thermal test vehicle design: Requirements, evaluations, and validations

by Goh, Teck Joo, Chu, Chia Pin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Published 2014

Optimization of PCB component placement using genetic algorithm

by Jeevan, Kanesan, Parthiban, A., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach

by Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Jeevan, Kanesan
Published 2014

Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM

by Hegde., Pradeep G., Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Aswatha Narayana, P. A., Mohd Zulkifly, Abdullah, Zainal Alimuddin, Zainal Alauddin, Dr.
Published 2014

Thermal management of multichipmodule (MCM) using genetic algorithms

by Jeevan, Kanesan, Seetharamu, Kankanhally N., Ishak, I.A., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014

Flow analysis for flip chip underfilling process using characteristic based split method

by Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Aswatha Narayana, P. A., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Published 2014