#TITLE_ALTERNATIVE#

• Main Author: (NIM : 13706016); Pembimbing : Dr. Ir. Aditianto Ramelan; Ir. Numan Basir;, ANDI
• Format: Final Project
• Language: Indonesia
• Online Access: https://digilib.itb.ac.id/gdl/view/14871
• Institution: Institut Teknologi Bandung

Brass electroplating is a process to plate brass (Cu-Zn alloys) at other metals surface with electrochemistry reaction. Commonly, brass electroplating process is used to increase decorative aspect of the plated metals. In this experiment, I used 100 g ZONAX BRASS SALTTM (CuCN-ZnO powder) electrolite solution and ammonia 20 ml from PT. SBT, also varied voltage from 1 – 3,5 v, time from 1,5 – <br /> <br /> <br /> <br /> <br /> <br /> <br /> 3,5 minutes, and agitation with air bubbles or cathode movements to U profiled ST-37 steel plate. After that, results of the brass electroplating process were analyzed with visual examination and characterized with hardness, thickness, dan composition test. <br /> <br /> <br /> <br /> <br /> <br /> <br /> From the analysis that has been done, it can be concluded that voltage that results the best colour is 1 v, the lowest voltage. The best processing time for decorative <br /> <br /> <br /> <br /> <br /> <br /> <br /> applications is 1,5 minutes because brass depositions just give the colour effect, so what we need is the minimum time for plating all surfaces of the sample. Agitation can increase the total Zn contents till Cu-Zn composition of the deposit is 50-50, moreover the solution formed complex ions with the same anions of Cu and Zn. Deposits’ composition do not homogeneous because of the non-stabilized current densities from the fixed processes voltage. Zn element avalability which is much more than its anode is caused by excessive ammonia addition in electrolite solution. Hardness testing with Microvickers 0,2 kg on the sample surface and thickness testing with coating tester Digi-Derm Mitutoyo are invalid because the <br /> <br /> <br /> <br /> <br /> <br /> <br /> deposited brass is very thin (0,261 &#956;m). Better agitation effect to avoid blister can’t be assured yet because the brass deposition is very thin which is imposibble to do addhesive test. It is needed to do more experiments to understand brass electroplating mechanisms in details.