IMPLEMENTATION OF COMPUTER VISION ON PICK-ANDPLACE MACHINE FOR SMALL-SCALE ELECTRONIC BOARD ASSEMBLY
Pick-and-place equipment for assembly of electronic boards is generally equipped with a computer-vision module to increase accuracy and prevent assembly errors. In this final project, a computer vision module was developed which is part of the development of a pick-and place machine prototype. Th...
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Main Author: | |
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Format: | Final Project |
Language: | Indonesia |
Online Access: | https://digilib.itb.ac.id/gdl/view/54189 |
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Institution: | Institut Teknologi Bandung |
Language: | Indonesia |
Summary: | Pick-and-place equipment for assembly of electronic boards is generally equipped
with a computer-vision module to increase accuracy and prevent assembly errors.
In this final project, a computer vision module was developed which is part of the
development of a pick-and place machine prototype. The implemented computer
vision aims to obtain the center-point (centroid) position of the component package
to be assembled. The goal is to position the nozzle of the head at this centroid point
when picking up the component. The image of the component was captured using a
digital microscope with a resolution of 640x480 pixels. The processes carried out
by the computer-vision module include several steps: (i) image-capture, (ii) image
processing (iii) the centroid determination, and (iv) position the nozzle to the
component's centroid. The digital-microscope is located at a height of 3 cm. The
capture area of the computer-vision is 10 x 7.5 mm. Image processing is carried
out using OpenCV library. The image is taken from above the component, which is
known as look-down vision. After that, the captured image is processed by the
contour identification method followed by the determination of its centroid. The
processes of controlling camera operation, image processing, centroid
determination and head movements are carried out using Raspberry Pi 4 board.
The implemented computer vision algorithm has succeeded in recognizing the
contours and determining the midpoints of two types of components: SOIC-8 (Small
Outline IC 8 pin) and SMD 2012 resistor components, withe the size of 2 mm x 1.25
mm. |
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