INTELLIGENCE NOVEL SUBSTRATE TECHNOLOGY PROPERTIES IN ELECTRIC VEHICLES AND RENEWABLE ENERGIES APPLICATIONS: EXPERIMENTAL CHARACTERIZATION

• Main Author: Maulana Sutardi, Bagas
• Format: Theses
• Language: Indonesia
• Online Access: https://digilib.itb.ac.id/gdl/view/81773
• Institution: Institut Teknologi Bandung

Up to this moment, insulated metal ceramic substrates are still some of the most used and critical components in electrical conventional high-power modules. Moreover, heat flow from the junction to the top case and thermal resistance can be examined. To improve the module's cooling performance, must reduce the heat conductivity from the junction to the case. In the conventional ceramic substrates (silicon nitride Si3N4, silicon oxide SiO2, aluminum oxide AI2O3) path, it can be worked by replacing the conductive substrate with a higher one, reducing the thickness, increasing the contact area components, and optimizing the thickness of conductor layers to spread the thermal conditions. In order to solve reliability issues, Infineon proposed a novel power module with a highly thermal conductive insulating metal substrate (IMS) which is basically epoxy resin encapsulation, cheaper material but not fragile. The objective of this project is to define the thermal analysis, reliability performance evaluation, and electrical characterization of an insulated metal substrate (IMS)-based power module discussed in this study. We tried to explore kind of characterization focuses on the surface properties of the IMS, and its interaction with embedding medium. We will measure PDIV and assumed that after PDIV inception, the residual lifetime of the device is too short. Next test, we will try to testing at room temperature, embedding specimens in silicone gelAs a transient thermal performance. Insulated Metal Substrate and epoxy-resin IMS will be tested with accurate condition evaluation of these dynamic and static experimental tests. The expected results of this study will be performing a comparative study between each thermal characteristic, cost comparison, thermal resistance, and maximal power dissipation.