THE STUDY OF THE POTENTIAL USE OF RHIZOPUS OLIGOSPORUS (TEMPEH YEAST) AND RICE HUSK TO FORM MYCELIUM BASED COMPOSITE (MBC) MATERIAL

• Main Author: Thariq Resmaindra, Muhammad
• Format: Theses
• Language: Indonesia
• Subjects: Teknik sipil
• Online Access: https://digilib.itb.ac.id/gdl/view/84388
• Institution: Institut Teknologi Bandung

Innovation in materials is needed to reduce the environmental impact of the construction. One of the alternatives currently being developed is mycelium-based composite (MBC) material. MBC material is a lightweight material that utilizes mycelium in the growth process of fungal species as a binder to form material. This material has the potential to be an alternative because of its low energy in the manufacturing process and environmentally friendly characteristics. As the binder to form tempeh, Rhizopus oligosporus on tempeh yeast also has the potential to be used to form MBC material. However, its fungal mycelium in MBC material and its properties have never been studied. Further research is required to know the use of Rhizopus oligosporus fungal inoculum as a binder in MBC material. The two-stage experimental study is conducted on the mixtures of Rhizopus oligosporus fungal inoculum (tempeh yeast), rice husks, and water. The first stage is to determine the compressive strength and density produced by each material sample variation of a mixture of tempe yeast: husk: water of 1:1:2, 1:1:1.6, 1:1:1.2, 1:1.5:2.5, 1:1.5:2, 1:1.5:1.5, 1:2:3, 1:2:2.4 and 1:2:1.8. After determining the best mixture in the first series, a second stage of research was carried out to review the growth, morphology, water absorption and thermal conductivity of the sample. This material's mechanical and physical properties are compared with conventional construction materials. The results show that the best compressive strength is obtained in the 1:1:1.6 mixture with an average compressive strength of 39.19 kPa, 83.86 kPa and 162.71 kPa at strains of 10%, 25% and 40%, with an average density of 176.31 kg/ m3, 33.48%-37% of volume and 181.19-193.04% of mass capacity of water absorption, and thermal conductivity of 0.045-0.047 W/mK. The growth process and morphology of this material are observed. Even though it has low compressive strength compared to other materials, this material has the advantages of light density and low thermal conductivity.