Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test
Solder joint is important for providing mechanical support and functionality of electronic packaging. Established solder joint should be able to withstand in device service operation and the environment without significant changes in terms of their microstructural evolution and mechanical properti...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2020
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| Online Access: | http://journalarticle.ukm.my/16167/1/14.pdf http://journalarticle.ukm.my/16167/ https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
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| Institution: | Universiti Kebangsaan Malaysia |
| Language: | English |