Effect of Sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications

• Main Authors: Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, Atiqah, A., Fakhrozi Che Ani, Ibrahym Ahmad, Zol Effendi Zolkefli
• Format: Article
• Language: English
• Published: Penerbit Universiti Kebangsaan Malaysia 2023
• Online Access: http://journalarticle.ukm.my/23254/1/SB%2018.pdf; http://journalarticle.ukm.my/23254/; https://www.ukm.my/jsm/english_journals/vol52num11_2023/contentsVol52num11_2023.html
• Institution: Universiti Kebangsaan Malaysia

The wettability of solder is important to achieve good solderability between the electronic component and printed circuit board (PCB). Tin (Sn) plating is widely used to promote the wettability of the solder on the substrates. However, an adequate amount of Sn plating thickness must be taken into co...