Design and development of multi-transceiver lorafi board consisting LoRa and ESP8266-wifi communication module
The advancement of Micro-Electro-Mechanical-Systems (MEMS), microcontroller technologies and the idea of Internet of Things (IoT) motivates the development of wireless modules (e.g. WiFi, Bluetooth, Zigbee, and LoRa) that are small and affordable. This paper aims to provide detailed information on...
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Main Authors: | , , , , , , , , |
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Format: | Conference or Workshop Item |
Language: | English English |
Published: |
2018
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Subjects: | |
Online Access: | http://eprints.unisza.edu.my/1703/1/FH03-FIK-18-13710.jpg http://eprints.unisza.edu.my/1703/2/FH03-FIK-19-23967.pdf http://eprints.unisza.edu.my/1703/ |
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Institution: | Universiti Sultan Zainal Abidin |
Language: | English English |
Summary: | The advancement of Micro-Electro-Mechanical-Systems (MEMS), microcontroller technologies and the idea of Internet
of Things (IoT) motivates the development of wireless modules (e.g. WiFi, Bluetooth, Zigbee, and LoRa) that are small
and affordable. This paper aims to provide detailed information on the development of the LoRaFi board. The LoRaFi
1.0 is a multi-protocol communication board developed by Centre of Excellence for Advanced Sensor Technology
(CEASTech). The board was developed for but not limited to monitor the indoor air quality. The board comprises two
different wireless communication modules namely, Long-range technology (LoRa) and WiFi (using ESP8266). The
board can be configured to communicate either using LoRa or WiFi or both. The board has been tested and the
wireless communication operates successfully. Apart from LoRa, WiFi enables data to be forwarded to the
cloud/server where the data can be stored for further data analysis. This helps provide users with real-time
information on their smartphones or other applications. In the future, researchers will conduct tests to investigate the
communication link quality. Newer version with reduced board size and additional wireless communication module
will be developed in the future as to increase board flexibility and widen the range of applications that can use the
board. |
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