Comparison of Microstructure and Hardness of Sintered Carbon Fiber and Carbon Nanotubes Reinforced Copper Matrix
Rapid growth of advance electronics device in electronics industry has its limitation in overheating problem. The solution for this limitation is by introducing the heat sinking material which has excellent properties such as higher thermal conductivity, hardness and strength. This report presents r...
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| Format: | Final Year Project |
| Language: | English |
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Universiti Teknologi Petronas
2009
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| Online Access: | http://utpedia.utp.edu.my/719/1/NORAINI_BINTI_ESA-REPORT.pdf http://utpedia.utp.edu.my/719/ |
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| Institution: | Universiti Teknologi Petronas |
| Language: | English |