Numerical evaluation of adhesive bonding quality using electromechanical impedance technique

• Main Authors: Ahmed, Zaheer, Hrairi, Meftah, Yazid, Zakwan
• Format: Article
• Language: English; English
• Published: Semarak Ilmu Publishing 2024
• Subjects: TA349 Mechanics of engineering. Applied mechanics; TH3301 Maintenance and repair; TJ212 Control engineering
• Online Access: http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf; http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf; http://irep.iium.edu.my/114088/; https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322; https://doi.org/10.37934/aram.120.1.122135
• Institution: Universiti Islam Antarabangsa Malaysia

A joint is a crucial approach in the engineering field, especially when it comes to the completion of a structure. Engineers must inspect the structure's quality so that damage can be avoided. Many academic and industry researchers have recently expressed interest in the creation of a real-t...