Modeling of the reliability baseline for process control monitoring kerf structures

We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or tes...

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Main Authors: Izuddin, Ismah, Kamaruddin, Mohd. Hanif, Nordin, Anis Nurashikin
Format: Conference or Workshop Item
Language:English
Published: 2011
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Online Access:http://irep.iium.edu.my/19885/1/Modeling_of_the_Reliability_Baseline_for_Process.pdf
http://irep.iium.edu.my/19885/
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6088327
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Institution: Universiti Islam Antarabangsa Malaysia
Language: English
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spelling my.iium.irep.198852012-02-17T07:40:09Z http://irep.iium.edu.my/19885/ Modeling of the reliability baseline for process control monitoring kerf structures Izuddin, Ismah Kamaruddin, Mohd. Hanif Nordin, Anis Nurashikin TA Engineering (General). Civil engineering (General) We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or test key) separating product die on the wafer. The motivation of this work is to establish the baseline of the dielectric and device reliability for the kerf PCM structure that will enhance the capability to perform lot disposition in the event of PCM test out-of-control (OOC). Different test structures will be stressed and correlation study is performed with existing models. The experiment was performed at Infineon Technologies Kulim Failure Analysis Lab and that test wafers were fabricated by Infineon Technologies. 2011-12-01 Conference or Workshop Item REM application/pdf en http://irep.iium.edu.my/19885/1/Modeling_of_the_Reliability_Baseline_for_Process.pdf Izuddin, Ismah and Kamaruddin, Mohd. Hanif and Nordin, Anis Nurashikin (2011) Modeling of the reliability baseline for process control monitoring kerf structures. In: 2011 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 28-30 September, Kota Kinabalu, Malaysia. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6088327
institution Universiti Islam Antarabangsa Malaysia
building IIUM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider International Islamic University Malaysia
content_source IIUM Repository (IREP)
url_provider http://irep.iium.edu.my/
language English
topic TA Engineering (General). Civil engineering (General)
spellingShingle TA Engineering (General). Civil engineering (General)
Izuddin, Ismah
Kamaruddin, Mohd. Hanif
Nordin, Anis Nurashikin
Modeling of the reliability baseline for process control monitoring kerf structures
description We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or test key) separating product die on the wafer. The motivation of this work is to establish the baseline of the dielectric and device reliability for the kerf PCM structure that will enhance the capability to perform lot disposition in the event of PCM test out-of-control (OOC). Different test structures will be stressed and correlation study is performed with existing models. The experiment was performed at Infineon Technologies Kulim Failure Analysis Lab and that test wafers were fabricated by Infineon Technologies.
format Conference or Workshop Item
author Izuddin, Ismah
Kamaruddin, Mohd. Hanif
Nordin, Anis Nurashikin
author_facet Izuddin, Ismah
Kamaruddin, Mohd. Hanif
Nordin, Anis Nurashikin
author_sort Izuddin, Ismah
title Modeling of the reliability baseline for process control monitoring kerf structures
title_short Modeling of the reliability baseline for process control monitoring kerf structures
title_full Modeling of the reliability baseline for process control monitoring kerf structures
title_fullStr Modeling of the reliability baseline for process control monitoring kerf structures
title_full_unstemmed Modeling of the reliability baseline for process control monitoring kerf structures
title_sort modeling of the reliability baseline for process control monitoring kerf structures
publishDate 2011
url http://irep.iium.edu.my/19885/1/Modeling_of_the_Reliability_Baseline_for_Process.pdf
http://irep.iium.edu.my/19885/
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6088327
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