Mould design for handphone casing using moldflow

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Bibliographic Details
Main Authors: Mohamed Ariff, Tasnim Firdaus, Law, Siah Yong
Format: Book Chapter
Language:English
Published: IIUM Press 2011
Subjects:
Online Access:http://irep.iium.edu.my/21330/1/3.pdf
http://irep.iium.edu.my/21330/
http://rms.research.iium.edu.my/bookstore/default.aspx
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Institution: Universiti Islam Antarabangsa Malaysia
Language: English
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